The objective of the research program is to characterize the role and influence of the high pressure phase transformations of semiconductors and ceramics during the manufacturing processing such as precision machining.  This material behavior may be exploited to improve manufacturing processes by increases yields, decreasing defects, and reducing the manufacturing costs of devices and products manufactured from these materials.  The research plan extends significantly the understanding of the fundamental principles and mechanics of the deformation phenomena/ mechanisms and machining of these hard-brittle materials.

Machining of Ceramics

Machining of SiC

Raman Measurements of Machined SiN

Ductile Regime Machining of Ceramics

(Image: ductile machining of SiC)

 

Links

Machining of Ceramic Materials (MDA Update)